d a t a sh eet product data sheet supersedes data of 2001 sep 19 2003 oct 15 discrete semiconductors PEMB3; pumb3 pnp/pnp resistor-equipped transistors; r1 = 4.7 k , r2 = open
2003 oct 15 2 nxp semiconductors product data sheet pnp/pnp resistor-equipped transistors; r1 = 4.7 k , r2 = open PEMB3; pumb3 features ? built-in bias resistors ? simplified circuit design ? reduction of component count ? reduced pick and place costs. applications ? low current peripheral drivers ? replacement of general purpose transistors in digital applications ? control of ic inputs. description pnp/pnp resistor-e quipped transistors (see ?simplified outline, symbol and pinning? for package details). quick reference data symbol parameter typ. max. unit v ceo collector-emitter voltage ? ? 50 v i o output current (dc) ? ? 100 ma tr1 pnp ? ? ? tr2 pnp ? ? ? r1 bias resistor 4.7 ? k r2 bias resistor open ? ? product overview note 1. * = p: made in hong kong. * = t: made in malaysia. * = w: made in china. simplified outline, symbol and pinning type number package marking code npn/pnp complement npn/npn complement philips eiaj PEMB3 sot666 ? z3 pemd6 pemh7 pumb3 sot363 sc-88 b5* (1) pumd6 pumh7 type number simplified outline and symbol pinning pin description PEMB3 1 emitter tr1 pumb3 2 base tr1 3 collector tr2 4 emitter tr2 5 base tr2 6 collector tr1 handbook, halfpage mam452 123 4 6 5 top view 654 123 tr1 tr2 r1 r1
2003 oct 15 3 nxp semico nductors product data sheet pnp/pnp resistor-equipped transistors; r1 = 4.7 k , r2 = open PEMB3; pumb3 ordering information limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. device mounted on an fr4 printed-circuit board, single-sided copper, standard footprint. 2. reflow soldering is the only recommended soldering method. type number package name description version PEMB3 ? plastic surface mounted package; 6 leads sot666 pumb3 ? plastic surface mounted package; 6 leads sot363 symbol parameter conditions min. max. unit per transistor v cbo collector-base voltage open emitter ? ? 50 v v ceo collector-emitter voltage open base ? ? 50 v v ebo emitter-base voltage open collector ? ? 5 v i o output current (dc) ? ? 100 ma i cm peak collector current ? ? 100 ma p tot total power dissipation t amb 25 c sot363 note 1 ? 200 mw sot666 notes 1 and 2 ? 200 mw t stg storage temperature ? 65 +150 c t j junction temperature ? 150 c t amb operating ambient temperature ? 65 +150 c per device p tot total power dissipation t amb 25 c sot363 note 1 ? 300 mw sot666 notes 1 and 2 ? 300 mw
2003 oct 15 4 nxp semico nductors product data sheet pnp/pnp resistor-equipped transistors; r1 = 4.7 k , r2 = open PEMB3; pumb3 thermal characteristics notes 1. device mounted on an fr4 printed-circuit board, single-sided copper, standard footprint. 2. reflow soldering is the only recommended soldering method. characteristics t amb = 25 c unless otherwise specified. symbol parameter conditions value unit per transistor r th j-a thermal resistance from junction to ambient t amb 25 c sot363 note 1 625 k/w sot666 notes 1 and 2 625 k/w per device r th j-a thermal resistance from junction to ambient t amb 25 c sot363 note 1 416 k/w sot666 note 1 416 k/w symbol parameter conditions min. typ. max. unit i cbo collector-base cut-off current v cb = ? 50 v; i e = 0 ? ? ? 100 na i ceo collector-emitter cut-off current v ce = ? 30 v; i b = 0 ? ? ? 1 a v ce = ? 30 v; i b = 0; t j = 150 c ? ? ? 50 a i ebo emitter-base cut-off current v eb = ? 5 v; i c = 0 ? ? ? 100 na h fe dc current gain v ce = ? 5 v; i c = ? 1 ma 200 ? ? v cesat saturation voltage i c = ? 5 ma; i b = ? 0.25 ma ? ? ? 100 mv r1 input resistor 3.3 4.7 6.1 k c c collector capacitance i e = i e = 0; v cb = ? 10 v; f = 1 mhz ? ? 3 pf
2003 oct 15 5 nxp semico nductors product data sheet pnp/pnp resistor-equipped transistors; r1 = 4.7 k , r2 = open PEMB3; pumb3 package outlines unit b p cd e e 1 h e l p w references outline version european projection issue date 01-01-04 01-08-27 iec jedec eiaj mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 dimensions (mm are the original dimensions) 0.3 0.1 sot666 b p pin 1 index d e 1 e a l p detail x h e e a s 0 1 2 mm scale a 0.6 0.5 c x 123 4 5 6 plastic surface mounted package; 6 leads sot66 6 ys w m a
2003 oct 15 6 nxp semico nductors product data sheet pnp/pnp resistor-equipped transistors; r1 = 4.7 k , r2 = open PEMB3; pumb3 references outline version european projection issue date iec jedec eiaj sot363 sc-88 wb m b p d e 1 e pin 1 index a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 6 plastic surface mounted package; 6 leads sot363 unit a 1 max b p cd e e 1 h e l p qy w v mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 0.25 0.15 a 1.1 0.8 97-02-28
2003 oct 15 7 nxp semico nductors product data sheet pnp/pnp resistor-equipped transistors; r1 = 4.7 k , r2 = open PEMB3; pumb3 data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers general ? information in this docu ment is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shal l have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, airc raft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that su ch applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. expo sure to limiting values for extended periods may af fect device reliability. terms and conditions of sale ? nxp semico nductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile /terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in th is document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
nxp semiconductors contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2009 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors. no changes were made to the content, except for the legal definitions and disclaimers. printed in the netherlands r75/02/pp8 date of release: 2003 oct 15 document order number: 9397 750 11792
|
